Posts Tagged ‘Micron’
In the wake of last week’s fatal plane crash that took the life of its CEO, Micron Technology has appointed a successor, Mark Durcan. The former CTO has been with the company since 1984, and has — per company bylaws — been serving as interim chief since February 3rd. Robert Switz, the company’s previous Board Director, will assume the duties of Board Chairman and Mark Adams, formerly the VP of Worldwide Sales, has been named as the company’s President. In a press release announcing the appointments, the new CEO wrote that the company was “deeply saddened” to learn of the death of its top executive, and that the management team would work relentlessly to “continue to move the company forward.”
The CEO of Micron Technology, Steve Appleton, died in a small plane crash today in Boise, Idaho. He was 51.
Appleton worked at the company since 1983, starting on the night shift production line. He died piloting a Lancair experimental aircraft around Boise.
He is survived by his wife Dalynn and his children.
Micron is a major semiconductor supplier and most notably built a number of memorable laptops and hard drives during the early days of the dot com years. The company currently produces the Crucial and Lexar memory lines, among other hardware.
Realign the data and the previous 32 and 64 gigabit roadblocks to flash storage disappear. Today, Intel and Micron announced the first 128 gigabit NAND flash chip. The chip, which was created through the companies’ joint IM Flash Technologies venture, is smaller than a fingertip, created through a 20 nanometer manufacturing process and is capable of 333 megatransfers per second with the option of stacking as many as eight chips on top of each other. What makes the new NAND unique is its planar structure that allows individual memory cells to scale much smaller than before. When combined with a Hi-K/metal gate combo to keep the power leaks to a minimum, presto, you’ve got flash memory denser than your mother-in-law’s fruitcake. Mass production of the 128Gb chips isn’t due until the first half of 2012, but you can get a more in-depth intro to the future of flash right now in the PR below.
Manufacturers have been murmuring about 3D memory chips for years, but an escalation in recent radio chatter suggests the technology is on the cusp of becoming commercial. Intel unveiled a Hybrid Memory Cube (HMC) at IDF, which promises seven times the energy efficiency of today’s DDR3, and now IBM and Micron have shown their hand too. The pair just struck up a partnership to produce cubes using layers of DRAM connected by vertical conduits known as through-silicon vias (TSVs). These pillars allow a 90 percent reduction in a memory chip’s physical footprint, a 70 percent cut in its appetite for energy, and — best of all — a radical increase in bandwidth: HMC prototypes have already scored 128Gb/s, which makes 6Gb/s SATA III look like a bottleneck. It certainly sounds like a game-changer, unless of course some rival technology like ferroelectric memory gets there first.
Solid state storage is fantastic stuff, durable and lightning-quick, but it’s got its fair share of quirks — bits fail, pages fill up, and cells deteriorate over time. Typically, the onus is on a beefy controller to take care of your drive and make sure it lasts a good long while (which is why brand names like SandForce can make or break an SSD) but it looks like Micron is planning to usurp some of that responsibility with its new ClearNAND chips. Simply put, each ClearNAND memory module has a built-in 24-bit error correction engine, so your drive’s host controller doesn’t have to shoulder that load, and can focus on the good stuff — like getting your data delivered at speeds that would obliterate traditional hard drives. Micron says the new chips are available right now in 25nm sizes. Want a more technical rundown? Hit up our more coverage link to hear what this might mean for the error-prone future of the medium. PR after the break.
Continue reading Micron embeds error correction in flash memory chips, calls it ClearNAND
Apple iPhone 4 has Samsung and Micron chips: report
TOKYO/LOS ANGELES (Reuters) – Apple Inc’s newest iPhone features chips from Samsung Electronics, Micron Technology and STMicroelectronics, according to a teardown analysis by tech outfit iFixit.